MC-21's Die Cast MMC Products

MC-21 Al-SiC Die Cast Components

An Al-SiC composite material produced as die-cast components and tailored for use as heat spreaders, stiffeners, heat sinks, IGBT base plates, and other parts requiring reduced coefficient of thermal expansion (CTE), good thermal conductivity, and high elastic modulus.

Elastic Modulus of Al-SiC Die Castings

• Al-10 vol. % SiC = 12.5 Msi (or 86.2 Gpa)
• Al-20 vol. % SiC = 14.3 Msi (or 98.6 Gpa)
• Al-30 vol. % SiC = 18-20 Msi (or 124-130 Gpa)
• Al-40 vol. % SiC = 22-24 Msi (or 152-165 Gpa)

Other Properties (Depending on vol. % SiC)

• CTE: 11-16 ppm/°C
• Thermal Conductivity: 180 - 200 W/m-K
• Density: 2.7-2.9 gm/cc

Maunfacturing Characteristics

• Can be die-cast in much the same way as aluminum.
• Parts do not require plating. If plating is desired, Ni and Au plating can be performed using conventionsl processes for aluminum.
• Soldering or brazing is possible using conventional aluminum processes.
• Manufacturing costs are comparable to conventional die casting.

Al-SiC Die- or Squeeze-Cast Component Applications

• Microelectronic package stiffeners
• Thermal spreaders
• Heat sinks
• Any application where a stiffness higher than Al and/or a CTE lower than Al are required.

Al-SiC Product Availability

• Al-SiC remelt ingots are available at 10, 20, 30, or 40 vol. % SiC in several aluminum-silicon casting alloy compositions.
• Die- or squeeze-cast Al-SiC component prices are quoted on request.